IRF5210STRLPBF

IRF5210STRLPBF, Power MOSFET, D2PAK, -100V, -40A, International Rectifier

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PartNumber:: IRF5210STRLPBF

Brand:: International Rectifier - IR | Pack: DIP | D/C: 12+

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Products Upload time: 2012-07-30

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Part Number:IRF5210STRLPBF
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Product Summary

The IRF5210STRLPBF is a Fifth Generation HEXFET from International Rectifier. The IRF5210STRLPBF utilizes advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that the IRF5210STRLPBF is well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitablefor high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

Parametrics

IRF5210STRLPBF absolute maximum ratings: (1)ID @ TC = 25℃ Continuous Drain Current, VGS @ -10V: -40 A; (2)ID @ TC = 100℃ Continuous Drain Current, VGS @ -10V: -29 A; (3)Pulsed Drain Current, IDM: -140 A; (4)PD @TA = 25℃ Power Dissipation: 3.8 W; (5)PD @TC = 25℃ Power Dissipation: 200 W; (6)Linear Derating Factor: 1.3 W/℃; (7)Gate-to-Source Voltage, VGS: ±20 V; (8)Single Pulse Avalanche Energy, EAS: 780 mJ; (9)Avalanche Current, IAR: -21 A; (10)Repetitive Avalanche Energy, EAR: 20 mJ; (11)Peak Diode Recovery dv/dt, dv/dt: -5.0 V/ns; (12)Operating Junction and Storage Temperature Range, TJ, TSTG: -55 to +175℃; (13)Soldering Temperature, for 10 seconds 300 (1.6mm from case)℃.

Features

IRF5210STRLPBF features: (1)Advanced Process Technology; (2)Surface Mount (IRF5210S); (3)Low-profile through-hole (IRF5210L); (4)175℃ Operating Temperature; (5)Fast Switching; (6)P-Channel; (7)Fully Avalanche Rated.